
2
7674F–AVR–09/09
ATmega164P/324P/644P
1.
Pin Configurations
Figure 1-1.
Pinout ATmega164P/324P/644P
Note:
The large center pad underneath the QFN/MLF package should be soldered to ground on the
board to ensure good mechanical stability.
PA4 (ADC4/PCINT4)
PA5 (ADC5/PCINT5)
PA6 (ADC6/PCINT6)
PA7 (ADC7/PCINT7)
AREF
GND
AVCC
PC7 (TOSC2/PCINT23)
PC6 (TOSC1/PCINT22)
PC5 (TDI/PCINT21)
PC4 (TDO/PCINT20)
(PCINT13/MOSI) PB5
(PCINT14/MISO) PB6
(PCINT15/SCK) PB7
RESET
VCC
GND
XTAL2
XTAL1
(PCINT24/RXD0) PD0
(PCINT25/TXD0) PD1
(PCINT/RXD1/26/INT0) PD2
(PCINT/TXD1/27/INT1)
PD3
(PCINT28/XCK1/OC1B)
PD4
(PCINT29/OC1A)
PD5
(PCINT30/OC2B/ICP)
PD6
(PCINT31/OC2A)
PD7 VCC GND
(PCINT16/SCL)
PC0
(PCINT17/SDA)
PC1
(PCINT18/TCK)
PC2
(PCINT19/TMS)
PC3
PB4
(SS/OC0B/PCINT12)
PB3
(AIN1/OC0A/PCINT1
1)
PB2
(AIN0/INT2/PCINT10)
PB1
(T1/CLKO/PCINT9)
PB0
(XCK0/T0/PCINT8)
GND VCC PA
0
(ADC0/PCINT0)
PA
1
(ADC1/PCINT1)
PA
2
(ADC2/PCINT2)
PA
3
(ADC3/PCINT3)
TQFP/QFN/MLF